3D-MID Technology (using injection moulded thermoplastics) enables the integration of mechanical, electronic, optical and thermal functions into three-dimensional designs via selective metallisation, offering a high geometric design freedom and supports the miniaturisation of electronic devices. Applications such as position sensors, actuators, switches, and antennas can benefit from the manufacture of complex structures and shapes offering potentially significant savings in space, mass and weight, that cannot be realised with conventional electronic manufacturing methods.
The term MID can also include mechatronic integrated devices taking into account the fact that the three-dimensional carriers do not necessarily have to be injection moulded thermoplastics. Other materials, such as ceramics and thermosets can also be used, allowing the integration of sensors in complex structures or the integration of shielding, cooling and housing for optimal miniaturisation and weight saving. Even thermal functions such as heat dissipation and cooling can be realised using thermal conductive substrate materials and fully metallised surfaces.