EUROPRACTICE – MCM
European Commission, 4th Framework Project (FP4)
The rapidly changing market for embedded and portable computing exhibits a steadily growing demand for improved reliability and increasing processing performance in progressively smaller form factors. A Pentium® based Multi-Chip-Module (MCM) was designed and manufactured during the 4th Framework project «EUROPRACTICE-MCM». The main scientific and technical challenge of the project was to develop a technology demonstrator to show the potential of High Density Packaging (HDP) technologies.
Advantages of MCM-based solutions
The Pentium® MCM was mounted on thermally enhanced Plastic-Stud-Grid-Array (PSGA), a packaging technology using plastic studs moulded to the body of the package instead of large solder balls, which provides reliable, low cost packaging of high pin-count devices. An existing Pentium® module chipset with 2nd level cache (9 chips plus SMD components), DRAM interface and PCI host-bridge was used with thin film on silicon in a PSGA housing which was significantly smaller than the original packaged Pentium® processor, i.e. 25% of the original packaged Pentium®.
The SP5MX1 is a miniaturised version of the core of a Pentium® processor based Multi-Chip-Module (MCM) which is intended as a processor subsystem for use in mobile and embedded systems. First tests were successfully carried out with Windows NT running and some benchmark programs at a clock frequency of 100 MHz.