EUROPRACTICE – MCM
European Commission, 4th Framework Project (FP4)
The rapidly changing market for embedded and portable computing exhibits a steadily growing demand for improved reliability and increasing processing performance in progressively smaller form factors. A Pentium® based Multi-Chip-Module (MCM) was designed and manufactured during the 4th Framework project «EUROPRACTICE-MCM». The main scientific and technical challenge of the project was to develop a technology demonstrator to show the potential of High Density Packaging (HDP) technologies.
Advantages of MCM-based solutions
The Pentium® MCM was mounted on thermally enhanced Plastic-Stud-Grid-Array (PSGA), a packaging technology using plastic studs moulded to the body of the package instead of large solder balls, which provides reliable, low cost packaging of high pin-count devices. An existing Pentium® module chipset with 2nd level cache (9 chips plus SMD components), DRAM interface and PCI host-bridge was used with thin film on silicon in a PSGA housing which was significantly smaller than the original packaged Pentium® processor, i.e. 25% of the original packaged Pentium®.
The SP5MX1 is a miniaturised version of the core of a Pentium® processor based Multi-Chip-Module (MCM) which is intended as a processor subsystem for use in mobile and embedded systems. First tests were successfully carried out with Windows NT running and some benchmark programs at a clock frequency of 100 MHz.
A device was developed (specifically for advertising purposes) within the scope of iMpuls – the Migros Health Initiative, that can be integrated into a running shoe and emit an alarm as soon as the wearer no longer moves the shoe.
The 62 x 35 x 9.5 mm module is completely built into the shoe and includes controller, motion sensor, battery, wireless charging electronics and a piezo buzzer. The device can be switched on and off from the outside by placing the charging pad on the shoe. The housing was realised by means of 3D plastic printing.
Large Area Panel processing «LAP»
European Commission, 4th Framework Project (FP4)
Thin film High Density Integration (HDI) offers the ultimate solution for many existing and new applications requiring either high electrical performance, smaller size, or both. However, the costs of these types of substrates has always been prohibitive. The EU consortium «LAP» was formed to reduce the cost for thin-film substrates; the main goal of the project being the development and demonstration of low cost, high-density substrate manufacturing technology for first level die assemblies. i.e.
The suitability of LAP technology was further demonstrated with the commercial implementation of a Direct Broadcast Satellite Switch operating up to 2.4GHz.
Benefits of LAP Technology
The substrate technologies developed allows for a wide range of packaging options from inserted substrates into transfer-moulded packages to integrated MCM-L/D and MCM-M/D (M=metal) area array packages. This ongoing trend towards miniaturisation, increased functionality and higher frequencies offers several significant challenges, e.g.
Q-Belt Integrated Computer «QBIC»
Customer: ETH Zurich (IfE)
Designed to be comfortable to wear without compromising reliability «QBIC» is not just a wearable computer, it also serves a classic function… keeping your trousers up! Heart of the «QBIC» is a Intel Xscale CPU (Intel PXA263B1C400) which runs at a variable speed up to 400 MHz. The belt contains a battery, real-time clock and system bus extension for peripherals. Moreover the belt provides plugs for USB and serial devices (RS-232), VGA connector and power connector which can be used to attach to a mains supply, or an additional belt-attachable battery.
The buckle, which can be removed from the belt and slotted onto a developer board (for convenient programming), contains two circuit boards:
«QBIC» is a fully-fledged computer integrated into an everyday accessory – a belt !
Designed to Wear
Although originally developed as a research platform to collect and process sensory data for medical monitoring and context recognition projects, QBIC can be used for a variety of applications, e.g.
|Projects and groups using QBIC
Solderable Memory Module «SMM»
Art of Technology AG (internal project)
An elegant solution for industrial and medical applications providing a compact memory module with an electrical SD / MMC interface which is soldered directly onto a printed circuit board. With a size of 24 x 20 mm and a pitch of only 1.27 mm, it is significantly smaller than a standard SD / MMC card, has less demands on board design and can be used wherever space considerations are critical. Moreover, with a controlled Bill of Material (BOM) problems resulting from hardware and firmware changes to the NAND Flash controller are now a thing of the past.
Customised functions such as password protection, emergency deletion can also be realised. With it’s small form factor the SMM is the ideal choice for embedded systems in extremely demanding applications and environments.