Various

  • Europractice MCM

EUROPRACTICE – MCM

European Commission, 4th Framework Project (FP4)

The rapidly changing market for embedded and portable computing exhibits a steadily growing demand for improved reliability and increasing processing performance in progressively smaller form factors. A Pentium® based Multi-Chip-Module (MCM) was designed and manufactured during the 4th Framework project «EUROPRACTICE-MCM». The main scientific and technical challenge of the project was to develop a technology demonstrator to show the potential of High Density Packaging (HDP) technologies.

  • Europractice MCM - Pentium

Advantages of MCM-based solutions

  • simplification of system design
  • internal routing of high-speed host bus signals reduces power consumption and ringing
  • high frequencies & critical signals remain inside MCM
  • standard simple interfaces (PCI, DRAM)
  • reduced number of signal layers on motherboard
  • less aggressive board design rules
  • reduction of motherboard area
  • significant reduction in size (¼ of original size)
  • overall weight reduction
  • easily upgradeable (new processors / chipsets)
  • reduced time-to-market (no board changes required)
  • improved EMC and thermal performance
  • end-user needs no Pentium® knowledge

Results

The Pentium® MCM was mounted on thermally enhanced Plastic-Stud-Grid-Array (PSGA), a packaging technology using plastic studs moulded to the body of the package instead of large solder balls, which provides reliable, low cost packaging of high pin-count devices. An existing Pentium® module chipset with 2nd level cache (9 chips plus SMD components), DRAM interface and PCI host-bridge was used with thin film on silicon in a PSGA housing which was significantly smaller than the original packaged Pentium® processor, i.e. 25% of the original packaged Pentium®.

The SP5MX1 is a miniaturised version of the core of a Pentium® processor based Multi-Chip-Module (MCM) which is intended as a processor subsystem for use in mobile and embedded systems. First tests were successfully carried out with Windows NT running and some benchmark programs at a clock frequency of 100 MHz.

  • DBS Switch

Large Area Panel processing «LAP»

European Commission, 4th Framework Project (FP4)

Thin film High Density Integration (HDI) offers the ultimate solution for many existing and new applications requiring either high electrical performance, smaller size, or both. However, the costs of these types of substrates has always been prohibitive. The EU consortium «LAP» was formed to reduce the cost for thin-film substrates; the main goal of the project being the development and demonstration of low cost, high-density substrate manufacturing technology for first level die assemblies. i.e.

The suitability of LAP technology was further demonstrated with the commercial implementation of a 9:4 satellite switch operating up to 2.4GHz.

  • high density / low cost substrate technology
  • high performance MCM-D technology (50 µm line pitch & 50 µm via)
  • verification by prototyping on a LAP pilot line
  • compatibility of the LAP technologies of 3 manufacturers (within specified design rules)
  • verification of LAP technologies developed via 3 product demonstrators

Benefits of LAP Technology

The substrate technologies developed allows for a wide range of packaging options from inserted substrates into transfer-moulded packages to integrated MCM-L/D and MCM-M/D (M=metal) area array packages. This ongoing trend towards miniaturisation, increased functionality and higher frequencies offers several significant challenges, e.g.

  • increased functionality requires higher level of integration
  • high frequency applications demand high signal integrity
  • increased average component I/O density require still higher interconnect density
  • direct chip attach to board (COB) is increasing as this gives the lowest inductance and noise, combined with the highest I/O density
  • several chips in one package (MCM) or even a systems in a package (SIP) development are driven by increased functionality, reduced size and lower cost
  • QBIC - Q-Belt Integrated Computer

Q-Belt Integrated Computer «QBIC»

Customer: ETH Zurich (IfE)

Designed to be comfortable to wear without compromising reliability «QBIC» is not just a wearable computer, it also serves a classic function… keeping your trousers up! Heart of the «QBIC» is a Intel Xscale CPU (Intel PXA263B1C400) which runs at a variable speed up to 400 MHz. The belt contains a battery, real-time clock and system bus extension for peripherals. Moreover the belt provides plugs for USB and serial devices (RS-232), VGA connector and power connector which can be used to attach to a mains supply, or an additional belt-attachable battery.

The buckle, which can be removed from the belt and slotted onto a developer board (for convenient programming), contains two circuit boards:

  • a main board with the CPU, SDRAM and power supply, and
  • an extension board with the Bluetooth device, USB controllers and an MMC card slot
  • QBIC - Transparent
  • QBIC - Size Comparison

Architecture

  • QBIC - Architecture
Features
  • CPU XScale (Intel PXA263B1C400)
    – 400 MHz (scalable), 32 MB internal Flash
    – Dynamic Core Voltage Regulation
  • Memory
    – 256 MB SDRAM
    – MMC card slot (up to 2GB Flash)
  • Ports
    – USB (2 Host, 1 Client-optional)
    – 2 x RS-232C Serial Ports
    – VGA output (640×480)
    – GPIO-Pins
  • Bluetooth
  • Low Power RF Transceiver
  • 10 hour run-time (with external battery)
  • Hot-plug battery exchange
  • Small Size

  • QBIC

«QBIC» is a fully-fledged computer integrated into an everyday accessory – a belt !

Designed to Wear

Although originally developed as a research platform to collect and process sensory data for medical monitoring and context recognition projects, QBIC can be used for a variety of applications, e.g.

Typical ApplicationsProjects and groups using QBIC
  • monitoring medical parameters of critical patients
    (24 hours a day)
  • acquisition & analysis of data on user movement
    (for rehabilitation)
  • collection and analysis of user movement
    (for dance projects)
  • recognition & monitoring of daily activities
  • monitoring user actions in work processes
  • computer for reality games
  • location tracking
  • travel guide for tourists and travelers
  • Embedded Systems Lab
    University Passau, Germany
  • Fighting cardio-vascular diseases
    My Heart
  • Skoda car production
    WearIT@Work
  • gespag hospital management
    WearIT@Work
  • WearLab
    TZI, University Bremen, Germany
  • Solderable Memory Module

Solderable Memory Module «SMM»

Art of Technology AG (internal project)

An elegant solution for industrial and medical applications providing a compact memory module with an electrical SD / MMC interface which is soldered directly onto a printed circuit board. With a size of 24 x 20 mm and a pitch of only 1.27 mm, it is significantly smaller than a standard SD / MMC card, has less demands on board design and can be used wherever space considerations are critical. Moreover, with a controlled Bill of Material (BOM) problems resulting from hardware and firmware changes to the NAND Flash controller are now a thing of the past.

Customised functions such as password protection, emergency deletion can also be realised. With it’s small form factor the SMM is the ideal choice for embedded systems in extremely demanding applications and environments.